SEICA INC. PARTICIPATION AT APEX – FEBRUARY 27, 28 – MARCH 1, 2018, BOOTH 2323
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Seica Inc. participation at Apex, San Diego, California, February 27, 28 – March 1, 2018, Booth 2323, San Diego Convention Center.
Haverhill, MA January, 2018. Following the winning philosophy which characterized its business in testing and assembly over three decades, based on the constant and rapid innovation of its solutions, Seica will attend the Apex 2018 exhibition with many new products. Products will complement some restyling’s of solutions presented in the past, almost completely renewing the portfolio of Seica solutions, enhancing the level of technology applied to testing and assembly of electronic boards and components.
In booth 2323 Seica will showcase the new, fully automated, Pilot V8 next > series flying prober, featuring a renovated and stylish look thanks to the premium materials of the chassis, and innovative electrical testing performance, undoubtedly the most complete flying probing test platform on the market. In its most complete configuration, the Pilot V8 next > series tester will provide up to 20 mobile test resources for an electronic board, ranging from probes which can supply today up to 3 amperes, high-resolution cameras for automatic optical inspection, barcode reading, laser, capacitive probes, pyrometers, optical fiber sensors for LEDs, flying connectors for boundary scan and On Board Programming, up to high-frequency probes for measurements over 1.5 GHz (an absolutely unique performance on the market).
Highly oriented to medium and high volume production, the Pilot V8 next > series will be available in a fully-automated version, making its vertical architecture perfectly suitable to be combined with board loading/unloading modules, capable of hosting from 1 to 12 board magazines (even of different types). All of the automation modules are standard and available in the Seica Automation catalog. The HR (high resolution) version of the Pilot V8 next > series allows the system to test very small sized objects, around 30 μm, while the XL version extends the work area from the standard 610 x 540 mm to 800 x 650 mm, providing unique solutions for testing “extra-large” boards.
In a world’s preview, Seica will showcase the DRAGONFLY next > series, an AOI system providing optical inspection capabilities for through-hole technology (THT) components of electronic boards, as well conformal coating (CC), increasingly used today to protect the products after manufacturing. Both the THT and CC versions of the DRAGONFLY feature the opportunity to inspect one or both sides of the board, which is conveyed on a standard SMEMA compliant rail conveyor, driven by an intuitive and streamlined management software which will allow commissioning and application program development in a few hours. The DRAGONFLY technology will be made available to Seica customers also with possible customized solutions, to promote the best integration in the existing automated production lines. Additional conveyors, buffers, loaders/unloaders dedicated to boards for repair, in-line or stand-alone repair stations, are also available allowing for a complete customization of your SMT, and repair lines.
Seica will also exhibit the FIREFLY next>series LASER selective soldering system. This new Firefly, featuring a new attractive, stylish and renewed appearance compared to the Firefly version available on the market for over ten years, but capable of providing an outstanding technological leap. This system is capable of soldering both the top and bottom of the printed circuit board. Under the new shiny and bright “dress” made of steel and other premium materials, the Firefly next > series combines its 4 essential innovations: new high-efficiency LASER source, new spot angle on the board to be soldered, fully-programmable donut spot size, and perfect axial integration of the LASER. Utilizing vision and continuous temperature feedback of the solder joint during the solder process provides an outstanding throughput in terms of applicability and reliability compared to the past generation and current competitors.
Seica will exhibit its small, compact and economical In-circuit test system called the Mini 200 benchtop unit, with up to 768 hybrid channels. It will allow customers a low entry point into production test. In addition to the Mini 200, the Compact TK will be on display which utilizes a built-in receiver for easy swap out of fixtures. The Compact line has channel counts from 192-4608 in a variety of manual, in-line, and combinational ICT and functional test options.
The Digital Mixed-Signal Tester (DMT), will also be showcased. This is Seica’s solution to component and MEMS testing. This test solution has an extremely small size of 19 x 9 x 7 inches and boasts modular and scalable design, multisite and high parallel testing capability, and very low energy consumption. The DMT has ability to leverage your investment by moving the test programs development for validation from the laboratory or product validation environment to full mass production facilities.
And finally, systems showcased in the booth will be remotely monitored through the Industrial Monitoring solution “4.0 ready” by Seica. Parameters that will be monitored include current absorption, supply voltage, temperature, and system status indicators useful to indicate the correct operation. Seica’s interpretation of “4.0 Ready” will help ensure predictive maintenance and allow the systems to be compatible with the new standards of the fourth industrial revolution taking place today in production facilities around the world.