SEICA AT SEMICON WEST – OCTOBER 13-15 – BOOTH #238
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Seica, a global leader in advanced electronic test solutions, will showcase its latest innovations for the semiconductor industry at SEMICON West, taking place October 13–15, 2026, at the Moscone Center in San Francisco, CA, USA, at Booth #238.
The company will present its latest solutions for power and mixed-signal semiconductor testing, including two new systems from the S20 line, introduced in 2025, and the upcoming Flying Probe Pilot system for Probe Card Test, which will be unveiled as a market preview. Developed for precise electrical testing of complex Probe Cards, MLO (multilayer organic) structures, and ceramics, the new PILOT for Probe Card combines flexible hardware and software capabilities for pre-assembly, in-circuit, functional testing, and final probe card validation, while Seica's portfolio also includes specialized solutions for testing MEMS, wafers, and other semiconductor devices.
By combining deep application expertise with cutting-edge technology, SEICA delivers high-value test solutions that empower manufacturers to push the limits of performance, yield, and scalability. From R&D to high-volume production, its platforms are designed to support next-generation devices, including SiC and GaN, helping customers reduce time-to-market while ensuring the highest levels of quality and efficiency.
The Flying Probe Pilot solution for Probe Card Test combines hardware and software in a single platform, supporting testing throughout the probe card manufacturing process, from pre-assembly checks to final validation.
The system supports testing of individual MLO and PCB boards before assembly, as well as in-circuit (ICT) and functional testing of assembled PCBs. It also enables final probe card testing by combining the PCB with the MLO.
The final test includes ICT verification of every connection between the MLO and PCB interface. The System automatically generates dedicated test programs, taking into account resistance variations caused by differences in network lengths or MLO components.
Advanced DSP-based measurement technology and high-speed capacitive testing ensure accurate and reliable results, while the system's flexibility makes it suitable for complex probe card applications.
Pilot system for Probe Card Test is part of Seica's new OPERA Series, the next generation of open, scalable test solutions designed to meet the evolving challenges of electronics manufacturing. OPERA stands for Open Era, and embodies Seica's philosophy of flexibility, customization, and innovation through a modular hardware and software architecture.
SEICA also offers the S20 IS³, a cutting-edge system for testing discrete power devices such as SiC and GaN components. Designed for both static and dynamic analysis, it ensures precise characterization of key electrical parameters, helping manufacturers improve reliability and performance while reducing field failures.
Its advanced measurement system integrates DC static and AC dynamic testing in a single platform (“one-box” solution), delivering precise and repeatable results. The modular and scalable configuration allows users to expand capabilities and increase throughput (UPH – units per hour) as needed.
The intuitive, menu-driven software simplifies test setup, while integrated tools such as the oscilloscope support debugging and ensure full traceability of results.
Completing the lineup, the S20 RTH system provides accurate thermal resistance characterization with advanced power and cooling management. It enables detailed evaluation of thermal behavior in power devices, supporting optimized design, reliability, and safe operation. The RTH is not only used for product validation or characherization but can also be used in a production environment.
Transistors, including MOSFETs, BJTs, and IGBTs, are among the most critical semiconductor devices and are particularly sensitive to the interaction between power handling and input signals. In modern power supply design, both system efficiency and junction temperature are key considerations.
The S20 RTH evaluates thermal stress in power MOSFETs operating in switch-mode power supplies. By combining measured data with device physical characteristics, it enables accurate prediction of junction temperature and determination of appropriate thermal margins and heatsink requirements. This approach is essential for ensuring reliability, longevity, and safe operation within the device’s Safe Operating Area (SOA).
All systems feature Seica's VIVA™ software platform, designed to support intelligent integration across the customer’s manufacturing ecosystem, from MES interaction and traceability to real-time data collection and repair operations. VIVA also incorporates AI-based diagnostic enhancements to improve fault detection and suggest optimized test strategies.
2026 marks a milestone year for Seica as the company celebrates its 40th anniversary.
Seica, a Powerhouse of Smart Innovation, High-Performance, and Integrated Solutions, is waiting for you at Booth #238!